Mask frame and deposition apparatus including the same

ABSTRACT

A mask frame includes a support substrate including a plurality of inner side surfaces. The plurality of inner side surfaces defines a first opening through the support substrate. A heat dissipation plate is disposed on the plurality of inner side surfaces. A plurality of fixing portions is disposed between the support substrate and the heat dissipation plate. The plurality of fixing portions includes a plurality of adhesive portions attaching the support substrate to the heat dissipation plate.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority under 35 U.S.C. § 119 to Korean PatentApplication No. 10-2020-0141198, filed on Oct. 28, 2020 in the KoreanIntellectual Property Office, the disclosure of which is incorporated byreference in its entirety herein.

1. TECHNICAL FIELD

The present inventive concepts relate to a mask frame and a depositionapparatus including the same. More particularly, the present inventiveconcepts relate to a mask frame including a heat dissipation plate and adeposition apparatus including the mask frame.

2. DISCUSSION OF RELATED ART

A mask is used to manufacture a display device. The mask may includeopenings defined therethrough, and components of the display device aremanufactured on a substrate through the openings. For example, when thedisplay device includes a light emitting element, organic materialsrequired to manufacture a light emitting layer of the light emittingelement are deposited on the substrate through the openings of the mask.The mask may be disposed on a mask frame. In addition, organic materialsused to manufacture color filters are deposited on the substrate throughthe openings of the mask.

When a deposition process is repeated, the mask frame may be deformeddue to heat. When the mask frame is deformed, organic materials may notbe deposited in a precise manner which may result in errors in themanufacture of the display device, such as a decrease in pixel positionaccuracy.

SUMMARY

The present inventive concepts provide a mask frame that reduces orprevents deformation due to heat.

The present inventive concepts provides a deposition apparatus includingthe mask frame that reduces or prevents deformation due to heat.

According to an embodiment of the present inventive concepts, a maskframe includes a support substrate including a plurality of inner sidesurfaces. The plurality of inner side surfaces defines a first openingthrough the support substrate. A heat dissipation plate is disposed onthe plurality of inner side surfaces. A plurality of fixing portions isdisposed between the support substrate and the heat dissipation plate.The plurality of fixing portions includes a plurality of adhesiveportions attaching the support substrate to the heat dissipation plateand a plurality of second openings defined therethrough adjacent to theplurality of adhesive portions.

In an embodiment, the fixing portions are disposed directly between thesupport substrate and the heat dissipation plate.

In an embodiment, the support substrate includes a plurality of firstoverlap portions that overlaps the fixing portions and a plurality offirst non-overlap portions that does not overlap the fixing portions.The heat dissipation plate includes a plurality of second overlapportions that overlaps the fixing portions and a plurality of secondnon-overlap portions that does not overlap the fixing portions.

In an embodiment, first lateral side edge of the first overlap portionsand first lateral side edge of the second overlap portions aresubstantially parallel to each other in a cross-section.

In an embodiment, the heat dissipation plate and the support substrateare spaced apart from each other with the fixing portions interposedtherebetween.

In an embodiment, the support substrate includes a first upper surfaceand a first lower surface spaced apart from the first upper surface inone direction, the heat dissipation plate includes a second uppersurface and a second lower surface spaced apart from the second uppersurface in the one direction, and a first height of the supportsubstrate in a direction substantially perpendicular to the first uppersurface and the first lower surface is the same as a second height ofthe heat dissipation plate in a direction substantially perpendicular tothe second upper surface and the second lower surface.

In an embodiment, the heat dissipation plate includes one surfaceadjacent to the support substrate and the other surface spaced apartfrom the one surface in one direction and mirror-finished.

In an embodiment, the heat dissipation plate includes a plurality ofsub-heat dissipation plates, and each of the sub-heat dissipation platesis disposed on the inner side surfaces.

In an embodiment, the heat dissipation plate has an emissivity equal toor smaller than about 0.25.

In an embodiment, the heat dissipation plate includes at least one ofAg, Al, Cu, Cr, and Sn.

In an embodiment, each of the fixing portions has a thickness equal toor greater than about 0.05 mm and equal to or smaller than about 10 mmin a direction substantially perpendicular to the inner side surfacesand a side surface of the heat dissipation plate facing the inner sidesurfaces.

In an embodiment, the support substrate includes an upper surface and alower surface spaced apart from the upper surface in one direction, andeach of the inner side surfaces is inclined with respect to the uppersurface and the lower surface.

In an embodiment, the support substrate includes invar.

In an embodiment, the fixing portions are provided in three or morenumbers, and the three or more fixing portions are spaced apart fromeach other in a cross-section.

In an embodiment, the support substrate and the fixing portions includea same metal material as each other.

According to an embodiment of the present inventive concepts, adeposition apparatus includes a vacuum chamber. A deposition source isdisposed in the vacuum chamber. A mask frame is disposed above thedeposition source. A mask is disposed on the mask frame. The mask frameincludes a support substrate including a plurality of inner sidesurfaces. The plurality of inner side surfaces defines a first openingthrough the support substrate. A heat dissipation plate is disposed onthe plurality of inner side surfaces. A plurality of fixing portions isdisposed between the support substrate and the heat dissipation plate.Each of the fixing portions comprises a plurality of adhesive portionsattaching the support substrate to the heat dissipation plate and aplurality of second openings defined therethrough adjacent to theplurality of adhesive portions.

In an embodiment, the heat dissipation plate includes at least one ofAg, Al, Cu, Cr, and Sn, and the heat dissipation plate has an emissivityequal to or smaller than about 0.25.

In an embodiment, the deposition apparatus further includes a magnetdisposed on the mask.

According to an embodiment of the present inventive concepts, a maskframe includes a support substrate including a first opening definedtherethrough. A heat dissipation plate is disposed on the supportsubstrate. A plurality of fixing portions is disposed directly betweenthe support substrate and the heat dissipation plate. The heatdissipation plate and the support substrate are spaced apart from eachother by the plurality of fixing portions to reduce heat transfer fromthe heat dissipation plate to the support substrate.

In an embodiment, the mask frame includes the heat dissipation platedisposed on the support substrate, and thus, the deformation caused bythe heat is reduced.

In an embodiment, the deposition apparatus includes the mask frame inwhich the heat dissipation plate is disposed on the support substrate,and thus, a deposition accuracy is increased.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects of the present inventive concepts willbecome readily apparent by reference to the following detaileddescription when considered in conjunction with the accompanyingdrawings wherein:

FIG. 1 is an exploded perspective view showing a mask assembly accordingto an embodiment of the present inventive concepts;

FIG. 2 is a cross-sectional view taken along a line I-I′ of FIG. 1according to an embodiment of the present inventive concepts;

FIG. 3 is an exploded perspective view showing a portion of a mask frameaccording to an embodiment of the present inventive concepts;

FIG. 4 is an exploded perspective view showing a portion of a mask frameaccording to an embodiment of the present inventive concepts;

FIG. 5 is a perspective view showing a portion of a mask frame accordingto an embodiment of the present inventive concepts;

FIG. 6 is a cross-sectional view showing a deposition apparatusaccording to an embodiment of the present inventive concepts;

FIG. 7 is an enlarged cross-sectional view showing an area AA of FIG. 6according to an embodiment of the present inventive concepts;

FIG. 8 is a cross-sectional view showing a portion of a pixel formed bythe deposition apparatus shown in FIG. 6 according to an embodiment ofthe present inventive concepts;

FIG. 9A is an image showing a result of a thermal analysis with respectto a mask frame according to a comparative example; and

FIG. 9B is an image showing a result of a thermal analysis with respectto a mask frame according to an embodiment of the present inventiveconcepts.

DETAILED DESCRIPTION OF EMBODIMENTS

The present inventive concepts may be variously modified and realized inmany different forms, and thus specific embodiments will be exemplifiedin the drawings and described in detail hereinbelow. However, thepresent inventive concepts are not limited to the specific disclosedembodiments, and the present inventive concepts include allmodifications, equivalents, or replacements.

In the present disclosure, it will be understood that when an element orlayer is referred to as being “on”, “connected to” or “coupled to”another element or layer, it can be directly on, connected or coupled tothe other element or layer or intervening elements or layers may bepresent. When an element or layer is referred to as being “directly on”,“directly connected to” or “directly coupled to” another element orlayer, no intervening elements or layers may be present.

Like numerals refer to like elements throughout. In the drawings, thethickness, ratio, and dimension of components may be exaggerated foreffective description of the present inventive concepts.

As used herein, the term “and/or” includes any and all combinations ofone or more of the associated listed items.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. For example, these termsmay only be used to distinguish one element, component, region, layer orsection from another region, layer or section. Thus, a first element,component, region, layer or section discussed below could be termed asecond element, component, region, layer or section without departingfrom the teachings of the present inventive concepts. As used herein,the singular forms, “a”, “an” and “the” are intended to include theplural forms as well, unless the context clearly indicates otherwise.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper” and the like, may be used herein for ease of description todescribe the relationship of one element or feature to anotherelement(s) or feature(s) as shown in the figures.

Unless otherwise defined, all terms including technical and scientificterms used herein have the same meaning as commonly understood by one ofordinary skill in the art to which the present inventive conceptsbelong. It will be further understood that terms, such as those definedin commonly used dictionaries, should be interpreted as having a meaningthat is consistent with their meaning in the context of the relevant artand will not be interpreted in an idealized or overly formal senseunless expressly so defined herein.

It will be further understood that the terms “includes” and/or“including”, when used in this specification, specify the presence ofstated features, integers, steps, operations, elements, and/orcomponents, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, elements, components,and/or groups thereof.

Hereinafter, a mask frame and a deposition apparatus including the maskframe according to an embodiment of the present inventive concepts willbe explained in detail with reference to the accompanying drawings.

FIG. 1 is an exploded perspective view showing a mask assembly MASaccording to an embodiment of the present inventive concepts. FIG. 2 isa cross-sectional view taken along line I-I′ of FIG. 1 . In detail, FIG.2 shows the cross-sectional view taken along the line I-I′ of FIG. 1after a mask frame MF of FIG. 1 is assembled. FIGS. 3 and 4 are explodedperspective views showing a portion of a mask frame MF according to anembodiment of the present inventive concepts. FIG. 5 is a perspectiveview showing a portion of the mask frame MF, such as one of fixingportions FP included in the mask frame MF, according to an embodiment ofthe present inventive concepts.

Referring to the embodiment of FIG. 1 , the mask assembly MAS mayinclude the mask frame MF and a plurality of mask sticks MST disposed onthe mask frame MF. The mask frame MF may include a support substrate SU,a heat dissipation plate RH, and a plurality of fixing portions FPdisposed between the support substrate SU and the heat dissipation plateRH. The support substrate SU may include a first opening SU-OP definedtherethrough by a plurality of inner side surfaces, such as first andsecond inner side surfaces SU-F1 and SU-F2. The heat dissipation plateRH may be disposed on the first and second inner side surfaces SU-F1 andSU-F2 of the support substrate SU.

The mask sticks MST may be disposed on the mask frame MF. A portion ofthe mask sticks MST which extend longitudinally substantially parallelto a first direction in which a first directional axis DR1 extends(hereinafter, the “first direction”) may be disposed to overlap the maskframe MF. The mask sticks MST may be supported by the mask frame MF. Inthe present disclosure, the mask sticks MST and a mask MST (refer toFIG. 6 ) are assigned with the same reference numeral, and the masksticks MST are described as a representative example of the mask MST(refer to FIG. 6 ). The mask MST may be used for a deposition processwhen a display device is manufactured. However, embodiments of thepresent inventive concepts are not limited thereto and the shape, sizeand form of the mask MST may vary.

The mask sticks MST may have a rectangular shape in a plane defined bythe first directional axis DR1 and a second directional axis DR2. Asshown in the embodiment of FIG. 1 , the second directional axis DR2 maycross the first directional axis DR1 and the first and seconddirectional axis DR1, DR2, may each extend parallel to a surface of thesupport substrate SU. Relatively shorter sides of the mask sticks MSThaving the rectangular shape in the plane may extend longitudinally in adirection that is substantially parallel to the second directional axisDR2 (hereinafter, the “second direction”), and relatively longer sidesof the mask sticks MST having the rectangular shape in the plane mayextend in the first direction that is substantially parallel to thefirst directional axis DR1. The mask sticks MST may be arranged in thesecond directional axis DR2 to be spaced apart from each other. Forexample, an interval between the mask sticks MST adjacent to each otheramong the mask sticks may be constant in the second directional axisDR2. However, embodiments of the present inventive concepts are notlimited thereto and the arrangement, size and shape of the mask sticksMST may vary.

Each of the mask sticks MST may include a plurality of third openingsMST-OP defined therethrough. As shown in the embodiment of FIG. 1 , thethird openings MST-OP may be arranged along the first direction in onemask stick MST. In an embodiment, an interval between the third openingsMST-OP adjacent to each other among the third openings MST-OP may beconstant along the first direction. However, embodiments of the presentinventive concepts are not limited thereto.

The support substrate SU may be disposed under the mask sticks MST. Forexample, the support substrate SU may be disposed under the mask sticksMST in a third direction that is parallel to a third directional axisDR3 that is perpendicular to the first and second directions and whichmay be a thickness direction of the mask frame MF. The support substrateSU may include a metal material. For example, in an embodiment, thesupport substrate SU may include invar. The invar may be an alloy ofiron and nickel. However, embodiments of the present inventive conceptsare not limited thereto.

As shown in the embodiment of FIG. 1 , the support substrate SU may havea quadrangular ring shape. The support substrate SU may include thefirst opening SU-OP defined therethrough by the first and second innerside surfaces SU-F1 and SU-F2. The first opening SU-OP may have aquadrangular shape, and the first and second inner side surfaces SU-F1and SU-F2 of the support substrate SU may have a shape corresponding tofour sides of the quadrangular shape. For example, the first openingSU-OP of the support substrate SU may have a rectangular shape. Thefirst and second inner side surfaces SU-F1 and SU-F2 may have a shapecorresponding to two relatively shorter sides and two relatively longersides, respectively, which form the rectangular shape. For example, inan embodiment, the first inner side surfaces SU-F1 may extendlongitudinally substantially in the first direction parallel to thefirst directional axis DR1 and the second inner side surfaces SU-F2 mayextend longitudinally substantially in the second direction parallel tothe second directional axis DR2. In an embodiment, when viewed in aplane defined by the first directional axis DR1 and the seconddirectional axis DR2, a sum of the areas of the mask sticks MST may begreater than an area of the first opening SU-OP. When viewed in theplane defined by the first directional axis DR1 and the seconddirectional axis DR2, an area of the quadrangular shape defined by themask sticks MST may be greater than the area of the first opening SU-OP.

The support substrate SU may include a first upper surface SU-UF and afirst lower surface SU-DF spaced apart from the first upper surfaceSU-UF in the third direction in which the third directional axis DR3extends. As shown in the embodiment of FIG. 1 , the first upper surfaceSU-UF and the first lower surface SU-DF may be substantially parallel tothe plane defined by the first directional axis DR1 and the seconddirectional axis DR2. In an embodiment, the first and second inner sidesurfaces SU-F1 and SU-F2 may be inclined with respect to the first uppersurface SU-UF and the first lower surface SU-DF. For example, the firstand second inner side surfaces SU-F1 and SU-F2 may be inclined withrespect to the plane defined by the first directional axis DR1 and thesecond directional axis DR2. In an embodiment, the first and secondinner side surfaces SU-F1 and SU-F2 and the first lower surface SU-DFmay form an acute angle with respect to the plane defined by the firstdirectional axis DR1 and the second directional axis DR2. However,embodiments of the present inventive concepts are not limited theretoand the first and second inner side surfaces SU-Fla and SU-F2 a (referto FIG. 3 ) of a support substrate SU-a (refer to FIG. 3 ) may besubstantially perpendicular to the plane defined by the firstdirectional axis DR1 and the second directional axis DR2.

The fixing portions FP may be disposed on the support substrate SU. Forexample, as shown in the embodiment of FIG. 1 , the fixing portions FPmay be disposed directly on the first and second inner side surfacesSU-F1 and SU-F2 of the support substrate SU. The fixing portions FP mayfix the heat dissipation plate RH to the support substrate SU. Forexample the fixing portions FP may fix the heat dissipation plate RH tothe first and second inner side surfaces SU-F1 and SU-F2 of the supportsubstrate SU. In an embodiment, the fixing portions FP may include thesame metal material as that of the support substrate SU. For example,the fixing portions FP may include invar.

As shown in the embodiment of FIG. 1 , the fixing portions FP may bespaced apart from each other. For example, the fixing portions FP may bedisposed on the first and second inner side surfaces SU-F1 and SU-F2 andmay be spaced apart from each other at regular intervals. In theembodiment of FIG. 1 , three fixing portions FP are disposed on each ofthe first and second inner side surfaces SU-F1 and SU-F2. However,embodiments of the present inventive concepts are not limited theretoand the number of the fixing portions FP may vary and the spacing of thefixing portions FP may vary. For example, in an embodiment, the numberof the fixing portions FP disposed on one inner side surface may be fouror more in the mask frame MF. In an embodiment, the four or more fixingportions FP may be spaced apart from each other at regular intervals.

The fixing portions FP may be disposed directly between the supportsubstrate SU and the heat dissipation plate RH. For example, an uppersurface and a lower surface of the fixing portions FP may be in directcontact with the support substrate SU and the heat dissipation plate RH,respectively. In an embodiment, portions of the fixing portions FP,which are in direct contact with the support substrate SU and the heatdissipation plate RH, may be one of adhesive portions AP1, AP2, . . . ,and AP_(n) (refer to FIG. 5 ) described later.

The support substrate SU and the heat dissipation plate RH may be spacedapart from each other with the fixing portions FP interposedtherebetween. The heat dissipation plate RH may be disposed on thefixing portions FP. For example, the heat dissipation plate RH may bedisposed directly on the fixing portions FP. The heat dissipation plateRH may be disposed to correspond to the first and second inner sidesurfaces SU-F1 and SU-F2 of the support substrate SU. For example, theheat dissipation plate RH may entirely cover the first and second innerside surfaces SU-F1 and SU-F2.

The heat dissipation plate RH may be inclined with respect to the planedefined by the first directional axis DR1 and the second directionalaxis DR2. For example, first and second side surfaces RH-D1 and RH-D2 ofthe heat dissipation plate RH may be inclined with respect to the planedefined by the first directional axis DR1 and the second directionalaxis DR2. As shown in the embodiment of FIG. 1 , when viewed in theplane defined by the first directional axis DR1 and the seconddirectional axis DR2, an angle θ between the first and second sidesurfaces RH-D1 and RH-D2 of the heat dissipation plate RH and the secondlower surface RH-DF of the heat dissipation plate RH may be an acuteangle. The first and second side surfaces RH-D1 and RH-D2 of the heatdissipation plate RH may be disposed between a second upper surfaceRH-UF of the heat dissipation plate RH and a second lower surface RH-DFof the heat dissipation plate RH. The second upper surface RH-UF of theheat dissipation plate RH and the second lower surface RH-DF of the heatdissipation plate RH may be spaced apart from each other in the thirddirection in which the third directional axis DR3 extends. In anembodiment, the second upper surface RH-UF of the heat dissipation plateRH and the second lower surface RH-DF of the heat dissipation plate RHmay extend substantially parallel to the plane defined by the firstdirectional axis DR1 and the second directional axis DR2. However,embodiments of the present inventive concepts are not limited thereto.

For example, in an embodiment in which the first and second inner sidesurfaces SU-F1 a and SU-F2 a (refer to FIG. 3 ) of the support substrateSU-a are substantially perpendicular to the plane defined by the firstdirectional axis DR1 and the second directional axis DR2, first andsecond side surfaces RH-F1 a and RH-F2 a (refer to FIG. 3 ) of heatdissipation plates RH-a and RH-b may be substantially perpendicular tothe plane defined by the first directional axis DR1 and the seconddirectional axis DR2. A slope of the first and second side surfacesRH-D1, RH-D2, RH-F1 a, and RH-F2 a of the heat dissipation plates RH,RH-a, and RH-b with respect to the plane defined by the firstdirectional axis DR1 and the second directional axis DR2 may be changedto correspond to the slope of the first and second inner side surfacesSU-F1, SU-F2, SU-F1 a, and SU-F2 a with respect to the plane defined bythe first directional axis DR1 and the second directional axis DR2.

In an embodiment of the present inventive concepts, a second heightRH-H2 of the heat dissipation plate RH may be substantially the same asa first height SU-H1 of the support substrate SU. The first height SU-H1of the support substrate SU may be measured in a direction substantiallyperpendicular to the first upper surface SU-UF and the first lowersurface SU-DF. The second height RH-H2 of the heat dissipation plate RHmay be measured in a direction substantially perpendicular to the secondupper surface RH-UF and the second lower surface RH-DF of the heatdissipation plate RH. The second height RH-H2 of the heat dissipationplate RH and the first height SU-H1 of the support substrate SU may bemeasured in a direction substantially perpendicular to the plane definedby the first directional axis DR1 and the second directional axis DR2.For example, the second height RH-H2 of the heat dissipation plate RHand the first height SU-H1 of the support substrate SU may be lengths inthe third direction substantially parallel to the third directional axisDR3.

The heat dissipation plate RH may include a metal material. For example,in an embodiment, the heat dissipation plate RH may include at least onecompound selected from Ag, Al, Cu, Cr, and Sn. In an embodiment, theheat dissipation plate RH may have an emissivity that is less than orequal to about 0.25. In an embodiment, the emissivity of the heatdissipation plate RH may be less than an emissivity of a stainlesssteel. In an embodiment, stainless steel may be included in a depositionapparatus EV (refer to FIG. 6 ) in which a vacuum chamber CB (refer toFIG. 6 ) is installed. As an example, the emissivity of the heatdissipation plate RH may be less than or equal to about 0.20. However,embodiments of the present inventive concepts are not limited theretoand the emissivity of the heat dissipation plate RH may vary.

Objects with high emissivity may have a high energy absorption rate anda low energy reflectance. Objects with low emissivity may have a lowenergy absorption rate and a high energy reflectance. In an embodimentin which the heat dissipation plate RH has the relatively low emissivitythat is less than or equal to about 0.25, the energy absorption rate maydecrease, and the energy reflectance may increase.

As described above, the heat dissipation plate RH and the supportsubstrate SU may be spaced apart from each other by the fixing portionsFP. In an embodiment, each of the fixing portions FP may have athickness TO that is in a range of about 0.05 mm to about 10 mm. Forexample, the thickness TO of each of the fixing portions FP may be in arange of about 0.1 mm to about 10 mm. As shown in the embodiment of FIG.2 , the thickness TO of each of the fixing portions FP may be measuredin a direction substantially perpendicular to a third surface SU-F3 ofthe support substrate SU and a third surface RH-F3 of the heatdissipation plate RH. In an embodiment, the third surface SU-F3 of thesupport substrate SU may be one of the first and second inner sidesurfaces SU-F1 and SU-F2 (refer to FIG. 1 ) of the support substrate SU.The third surface RH-F3 of the heat dissipation plate RH may be thefirst side surface RH-D1 (refer to FIG. 1 ) of the heat dissipationplate RH facing the support substrate SU.

The third surface SU-F3 of the support substrate SU and the thirdsurface RH-F3 of the heat dissipation plate RH may face each other. Whenthe thickness of the fixing portions FP is within the above-describedthickness ranges, the heat dissipation plate RH may be spaced apart fromthe support substrate SU, and a heat transferred from the heatdissipation plate RH to the support substrate SU may be reduced orprevented. Accordingly, a deformation of the support substrate SU due tothe heat may be reduced or prevented.

FIG. 2 shows a structure in which three fixing portions FP are spacedapart from each other in a cross-section. As shown in the embodiment ofFIG. 2 , among the three fixing portions FP, two fixing portions FP maybe disposed adjacent to a first lateral side and the opposite secondlateral side of the support substrate SU, respectively, and theremaining one fixing portion FP among the three fixing portions FP maybe disposed to be spaced apart from the two fixing portions FP atregular intervals. In an embodiment, the first lateral side and theopposite second lateral side of the support substrate SU may extend inthe first direction that is substantially parallel to the firstdirectional axis DR1, and the first lateral side and the opposite secondlateral side of the support substrate SU may be spaced apart from eachother in the second direction parallel to the second directional axisDR2.

As shown in the embodiment of FIG. 2 , the support substrate SU mayinclude a plurality of first overlap portions P1 that overlaps thefixing portions FP and a plurality of first non-overlap portions NP1that does not overlap the fixing portions FP. The first overlap portionsP1 may be alternately arranged with the first non-overlap portions NP1.The heat dissipation plate RH may include a plurality of second overlapportions P2 that overlaps the fixing portions FP and a plurality ofsecond non-overlap portions NP2 that does not overlap the fixingportions FP. The second overlap portions P2 may be alternately arrangedwith the second non-overlap portions NP2. When viewed in across-section, lateral side edges of the first overlap portions P1 andlateral side edges of the second overlap portions P2 may besubstantially parallel to each other. The lateral side edges of thefirst overlap portions P1 and the lateral side edges of the secondoverlap portions P2 may be substantially parallel to lines “L1” and “L2”shown in FIG. 2 . For example, in FIG. 2 , “L1” and “L2” indicateimaginary lines extending respectively from the a first lateral sideedge of the first overlap portions P1 and the opposite second lateralside edge of the first overlap portions P1. Also, “L1” and “L2” may beimaginary lines extending respectively from a first lateral side edge ofthe second overlap portions P2 and the opposite second lateral side edgeof the second overlap portions P2.

FIGS. 3 and 4 are perspective views showing a mask frame MF according toembodiments of the present inventive concepts and show a portion of themask frame MF. In FIGS. 3 and 4 , fixing portions FP are omitted forconvenience of explanation, and the support substrate SU-a and the heatdissipation plates RH-a and RH-b are shown. Descriptions of the fixingportions FP described with reference to the embodiments of FIGS. 1 and 2may be applied to the fixing portions in FIGS. 3 and 4 and a repeateddescription thereof will be omitted for convenience of explanation.

Different from FIG. 1 , in the embodiments of FIGS. 3-4 , the first andsecond inner side surfaces SU-Fla and SU-F2 a of the support substrateSU-a are shown to be substantially perpendicular to a first uppersurface SU-UF and a first lower surface SU-DF of the support substrateSU-a. The first and second inner side surfaces SU-Fla and SU-F2 a of thesupport substrate SU-a may not be inclined with respect to the firstupper surface SU-UF and the first lower surface SU-DF of the supportsubstrate SU-a. For example, the first and second inner side surfacesSU-Fla and SU-F2 a may be substantially perpendicular to the first uppersurface SU-UF and the first lower surface SU-DF, and the first andsecond side surfaces RH-Fla and RH-F2 a of the heat dissipation platesRH-a and RH-b may be substantially perpendicular to the first uppersurface SU-UF and the first lower surface SU-DF of the support substrateSU-a. In an embodiment, the first and second inner side surfaces SU-Flaand SU-F2 a of the support substrate SU-a and the first and second sidesurfaces RH-Fla and RH-F2 a of the heat dissipation plates RH-a and RH-bmay extend substantially in the third direction that is parallel to thethird directional axis DR3.

As shown in the embodiment of FIG. 3 , the heat dissipation plate RH-amay include a plurality of sub-heat dissipation plates, such as first tofourth sub-heat dissipation plates RH-S1, RH-S2, RH-S3, and RH-S4. Thefirst to fourth sub-heat dissipation plates RH-S1, RH-S2, RH-S3, andRH-S4 may be disposed on the first and second inner side surfaces SU-Flaand SU-F2 a of the support substrate SU-a, respectively. One sub-heatdissipation plate may be disposed on one inner side surface SU-F2 a. Inan embodiment, each of the sub-heat dissipation plates may be spacedapart from each other. However, embodiments of the present inventiveconcepts are not limited thereto.

For example, as shown in the embodiment of FIG. 4 , the heat dissipationplate RH-b may have an integral shape corresponding to the first andsecond inner side surfaces SU-Fla and SU-F2 a of a support substrateSU-a. FIG. 4 shows the heat dissipation plate RH-b having sides thatextend in the third direction that is substantially parallel to thethird directional axis DR3. For example, the heat dissipation plate RH-bshown in the embodiment of FIG. 4 may not include an inclined surface.In an embodiment in which the first and second inner side surfacesSU-Fla and SU-F2 a of the support substrate SU-a are substantiallyperpendicular to the first upper surface SU-UF and the first lowersurface SU-DF of the support substrate SU-a, the heat dissipation plateRH-b may not include the inclined surface.

FIG. 5 is a perspective view showing a fixing portion FP according to anembodiment of the present inventive concepts. The fixing portion FP mayinclude the adhesive portions AP1, AP2, . . . , and AP_(n) that fix thesupport substrate SU to the heat dissipation plate RH. In an embodiment,the adhesive portions AP1, AP2, . . . , and AP_(n) may be portionswelded by a laser beam. The support substrate SU and the heatdissipation plate RH may be attached to the fixing portion FP by a laserwelding process. However, embodiments of the present inventive conceptsare not limited thereto, and a method of attaching the support substrateSU and the heat dissipation plate RH to the fixing portion FP may vary.

In addition, the fixing portion FP may be provided with a plurality ofsecond openings OP2-1, OP2-2, OP2-3, OP2-4, . . . , OP_(m-1), and OP_(m)defined therethrough and are positioned adjacent to the adhesiveportions AP1, AP2, . . . , and AP_(n). In an embodiment, the secondopenings OP2-1, OP2-2, OP2-3, OP2-4, . . . , OP_(m-1), and OP_(m) may bespaced apart from each other at regular intervals. For example, amongthe second openings OP2-1, OP2-2, OP2-3, OP2-4, . . . , OP_(m-1), andOP_(m), the interval between the second openings OP2-1, OP2-2, OP2-3,OP2-4, . . . , OP_(m-1), and OP_(m) adjacent to each other in onedirection may be constant. However, embodiments of the present inventiveconcepts are not limited thereto. For example, among the second openingsOP2-1, OP2-2, OP2-3, OP2-4, . . . , OP_(m-1), and OP_(m), the intervalbetween the second openings OP2-1, OP2-2, OP2-3, OP2-4, . . . ,OP_(m-1), and OP_(m) adjacent to each other in one direction may not beconstant.

In addition, the second openings OP2-1, OP2-2, OP2-3, OP2-4, . . . ,OP_(m-1), and OP_(m) may have a circular shape in a plane as shown inFIG. 5 . For example, the second openings OP2-1, OP2-2, OP2-3, OP2-4, .. . , OP_(m-1), and OP_(m) may have an elongated oval shape. However,embodiments of the present inventive concepts are not limited thereto.For example, the shape of the second openings OP2-1, OP2-2, OP2-3,OP2-4, . . . , OP_(m-1), and OP_(m) may vary and should not be limitedto the circular shape. Positions of the second openings OP2-1, OP2-2,OP2-3, OP2-4, . . . , OP_(m-1), and OP_(m) should not be limited topositions shown in the embodiment of FIG. 5 and the arrangement of thesecond openings OP2-1, OP2-2, OP2-3, OP2-4, . . . , OP_(m-1), and OP_(m)may vary.

The second openings OP2-1, OP2-2, OP2-3, OP2-4, . . . , OP_(m-1), OP_(m)may prevent accumulation of foreign matter. After the deposition processin the deposition apparatus EV according to an embodiment to bedescribed later, a cleaning process may be performed, and a materialused in the cleaning process may pass through the second openings OP2-1,OP2-2, OP2-3, OP2-4, . . . , OP_(m-1), OP_(m). Accordingly, it ispossible to prevent foreign matter from accumulating between the supportsubstrate SU and the heat dissipation plate RH.

The fixing portions FP may prevent the support substrate SU from makingdirect contact with the heat dissipation plate RH. For example, thesupport substrate SU may be spaced apart from the heat dissipation plateRH by the fixing portions FP. Since the support substrate SU is spacedapart from the heat dissipation plate RH, the heat absorbed by the heatdissipation plate RH may be prevented from being transferred to thesupport substrate SU.

The mask frame MF may be a structure to fix the mask sticks MST. Themask sticks MST may be used in the deposition process, and materials maybe deposited through the third openings MST-OP of the mask sticks MST.In an embodiment, a base substrate BS (refer to FIG. 6 ) on which thedeposition process is performed may be disposed above the mask sticksMST.

In a comparative embodiment in which the mask frame does not include theheat dissipation plate, the support substrate absorbs the heat. In thesupport substrate absorbing the heat, a deformation such as a thermalexpansion occurs. As the support substrate is deformed, the deformedsupport substrate alters the position of the mask sticks arranged abovethe support substrate, and a pixel position accuracy (PPA) is degraded.In an embodiment the mask frame MF may include the heat dissipationplates RH, RH-a, and RH-b disposed on the support substrates SU and SU-aand the fixing portions FP disposed between the support substrates SUand SU-a and the heat dissipation plates RH, RH-a, and RH-b.Accordingly, the deformation of the support substrates SU and SU-a dueto the heat transferred thereto may be reduced or prevented, and thepixel position accuracy of the mask frame MF may be increased.

Hereinafter, the deposition apparatus EV according to embodiments of thepresent inventive concepts will be described in detail with reference toFIGS. 6 to 8 . In descriptions of the deposition apparatus EV,repetitive descriptions of elements of the mask frame MF described withreference to FIGS. 1 to 5 will be omitted for convenience ofexplanation, and descriptions will be focused on different features.

FIG. 6 is a cross-sectional view showing the deposition apparatus EVaccording to an embodiment of the present inventive concepts. FIG. 7 isan enlarged cross-sectional view showing an area AA′ of FIG. 6 . FIG. 8is a cross-sectional view showing a portion of a pixel PX formed by thedeposition apparatus EV shown in FIG. 6 .

As shown in the embodiment of FIG. 6 , the deposition apparatus EV mayinclude a vacuum chamber CB, a deposition source VS, the mask frame MF,and the mask MST, and the deposition source VS, the mask frame MF, andthe mask MST may be disposed in the vacuum chamber CB. The mask frame MFmay be disposed above the deposition source VS. The mask MST may bedisposed above the mask frame MF. In an embodiment, the above-describedmask stick MST (refer to FIG. 1 ) may be the same as the mask MST.

The mask frame MF may include the support substrate SU, the heatdissipation plate RH, and the fixing portions FP. The support substrateSU may include the first opening SU-OP (refer to FIG. 1 ) defined by thefirst and second inner side surfaces SU-F1 and SU-F2 (refer to FIG. 1 ).The heat dissipation plate RH may be disposed on the first and secondinner side surfaces SU-F1 and SU-F2 (refer to FIG. 1 ) of the supportsubstrate SU. The fixing portions FP may be disposed directly on thefirst and second inner side surfaces SU-F1 and SU-F2 (refer to FIG. 1 )of the support substrate SU. The fixing portions FP may be disposedbetween the heat dissipation plate RH and the first and second innerside surfaces SU-F1 and SU-F2 (refer to FIG. 1 ) of the supportsubstrate SU. Each of the fixing portions FP may include the adhesiveportions AP1, AP2, . . . , and AP_(n) (refer to FIG. 5 ) to attach thesupport substrate SU to the heat dissipation plate RH. In addition, thefixing portions FP may include the second openings OP2-1, OP2-2, OP2-3,OP2-4, . . . , OP_(m-1), and OP_(m) (refer to FIG. 5 ) defined adjacentto the adhesive portions AP1, AP2, . . . , and AP_(n).

Referring to the embodiment of FIG. 6 , the deposition apparatus EV mayinclude a first stage ST1, a second stage ST2, a first member MB1, and asecond member MB2. The first stage ST1, the second stage ST2, the firstmember MB1, and the second member MB2 may be disposed in the vacuumchamber CB. The vacuum chamber CB may be maintained in a vacuum state.

The mask frame MF may be disposed on the first stage ST1. For example,as shown in the embodiment of FIG. 6 , the support substrate SU may bedisposed directly on the first stage ST1. An upper surface of the firststage ST1 may directly contact a lower surface of the support substrateSU. The first stage ST1 may be supported by the first member MB1. Thefirst member MB1 may be disposed under the first stage ST1.

The base substrate BS may be disposed directly on a lower surface of thesecond stage ST2. The second stage ST2 may be a member on which the basesubstrate BS is disposed. The base substrate BS may be fixed to thesecond stage ST2. The second member MB2 may be disposed on the secondstage ST2. For example, in an embodiment, the second member MB2 may be amagnet. The second member MB2 may fix the second stage ST2.

The deposition apparatus EV may be used to deposit a deposition materialVD on the base substrate BS. The base substrate BS may be disposed abovethe mask MST. As shown in the embodiment of FIG. 6 , the base substrateBS may have a single-layer structure. However, embodiments of thepresent inventive concepts are not limited thereto. For example, thebase substrate BS may have a multi-layer structure of a plurality oflayers. In an embodiment, an organic material may be deposited on thebase substrate BS. As described above, the deposition material VD may bedeposited on a first surface of the base substrate BS after passingthrough the third openings MST-OP of the mask MST. The first surface ofthe base substrate BS may not be in contact with the second stage ST2.For example, as shown in the embodiment of FIG. 6 , the first surfacemay be a bottom surface of the base substrate BS and the upper surfaceof the base substrate BS may directly contact the second stage ST2.

The deposition source VS may include the deposition material VD. In anembodiment, the deposition material VD may be heated in the depositionsource VS and sprayed upward. The deposition material VD may be sprayedtoward the base substrate BS. A heat radiation energy EA (refer to FIG.7 ) may be generated in the deposition source VS. Since the vacuumchamber CB is in the vacuum state, there is no heat transfer byconvection, and the heat radiation energy EA generated by the depositionsource VS may be absorbed or reflected by the mask frame MF after movingupward.

Referring to the embodiment of FIG. 7 , the heat dissipation plate RHmay include a first surface and an opposite second surface, such as thefirst side surface RH-D1 and the second side surface RH-D2.

The second side surface RH-D2 of the heat dissipation plate RH and thefirst side surface RH-D1 of the heat dissipation plate RH may be spacedapart from each other in one direction. The first side surface RH-D1 ofthe heat dissipation plate RH may be disposed adjacent to the supportsubstrate SU. For example, the first side surface RH-D1 of the heatdissipation plate RH may be in direct contact with the fixing portionFP. The second side surface RH-D2 of the heat dissipation plate RH maybe exposed to the deposition source VS. The second side surface RH-D2 ofthe heat dissipation plate RH exposed to the deposition source VS may beexposed to the heat radiation energy EA. In an embodiment, the secondside surface RH-D2 of the heat dissipation plate RH exposed to thedeposition source VS may be mirror-finished. When compared with a heatdissipation plate that is not mirror-finished, a reflectance of energymay be increased in the heat dissipation plate RH that ismirror-finished. As the energy reflectance increases in the second sidesurface RH-D2 of the heat dissipation plate RH, an energy absorptionrate may be reduced.

The mask frame including the support substrate in which the heatdissipation plate is not disposed may be deformed due to the heatradiation energy. As the support substrate is deformed by the heatradiation energy, the pixel position accuracy of the mask disposed onthe support substrate may be degraded. When the pixel position accuracyof the mask is degraded, a deposition accuracy may decrease in thedeposition process.

The mask frame MF may include the heat dissipation plate RH disposed onthe support substrate SU. As the heat dissipation plate RH is disposedon the support substrate SU, a direct exposure of the support substrateSU to the heat radiation energy may be reduced. In an embodiment, theheat dissipation plate RH may include at least one compound selectedfrom Ag, Al, Cu, Cr, and Sn, and the emissivity of the heat dissipationplate RH may be less than or equal to about 0.25. Accordingly, an amountof the heat transferred from the heat dissipation plate RH to thesupport substrate SU may be reduced. The heat dissipation plate RHhaving an emissivity that is lower than that of the material, such asstainless steel, in the vacuum chamber CB, may have a relatively lowabsorption rate of the heat radiation energy and a relatively highreflectance of the heat radiation energy.

In addition, in an embodiment in which the second side surface RH-D2 ofthe heat dissipation plate RH exposed to the deposition source VS ismirror-finished, the absorption rate of the heat radiation energy may bereduced. As the absorption rate of the heat radiation energy in the heatdissipation plate RH is reduced, the amount of the heat transferred tothe support substrate SU from the heat dissipation plate RH may bereduced. Accordingly, the deformation caused by the heat in the maskframe MF may be reduced or prevented, and the deposition accuracy in thedeposition apparatus EV including the mask frame MF may be increased.

Meanwhile, a plurality of metal sticks may be disposed under the maskMST. In addition, each of the metal sticks may be provide with aplurality of openings defined therethrough.

FIG. 8 is a cross-sectional view showing a pixel PX including a colorfilter CF formed by the deposition apparatus EV according to anembodiment of the present inventive concepts. As shown in the embodimentof FIG. 8 , the pixel PX may include a light emitting element OLED, atransistor TR connected to the light emitting element OLED, and thecolor filter CF disposed on the light emitting element OLED.

The light emitting element OLED may include a first electrode E1, asecond electrode E2, and a light emitting layer OEL disposed between thefirst electrode E1 and the second electrode E2 (e.g., in a thicknessdirection of the base layer SUB). The light emitting element OLED may bean organic light emitting element. In an embodiment, the light emittinglayer OEL may be an organic light emitting layer.

In an embodiment, the first electrode E1 may be an anode electrode, andthe second electrode E2 may be a cathode electrode. The first electrodeE1 may be a pixel electrode, and the second electrode E2 may be a commonelectrode.

The pixel PX may include a pixel area PA and a non-pixel area NPAadjacent to the pixel area PA. The light emitting element OLED may bedisposed in the pixel area PA, and the transistor TR may be disposed inthe non-pixel area NPA.

The transistor TR and the light emitting element OLED may be disposed ona base layer SUB. A buffer layer BFL may be disposed on the base layerSUB. In an embodiment, the buffer layer BFL may include an inorganicmaterial.

A semiconductor layer SM of the transistor TR may be disposed on thebuffer layer BFL. In an embodiment, the semiconductor layer SM mayinclude an inorganic semiconductor including amorphous silicon orpolycrystalline silicon or an organic semiconductor. In addition, thesemiconductor layer SM may include an oxide semiconductor. Thesemiconductor layer SM may include a source area, a drain area, and achannel area defined between the source area and the drain area.

A first insulating layer INS1 may be disposed on the buffer layer BFL tocover the semiconductor layer SM. In an embodiment, the first insulatinglayer INS1 may include an inorganic material. A gate electrode GE of thetransistor TR may be disposed on the first insulating layer INS1 tooverlap the semiconductor layer SM. The gate electrode GE may bedisposed to overlap the channel area of the semiconductor layer SM.

A second insulating layer INS2 may be disposed on the first insulatinglayer INS1 to cover the gate electrode GE. The second insulating layerINS2 may include an organic material and/or an inorganic material.

A source SE and a drain DE of the transistor TR may be disposed on thesecond insulating layer INS2 to be spaced apart from each other. Asshown in the embodiment of FIG. 8 , the source SE may be connected tothe source area of the semiconductor layer SM via a first contact holeCH1 defined through the first insulating layer INS1 and the secondinsulating layer INS2. The drain DE may be connected to the drain areaof the semiconductor layer SM via a second contact hole CH2 definedthrough the first insulating layer INS1 and the second insulating layerINS2.

A third insulating layer INS3 may be disposed on the second insulatinglayer INS2 to cover the source SE and the drain DE of the transistor TR.In an embodiment, the third insulating layer INS3 may include an organicmaterial.

The first electrode E1 may be disposed on the third insulating layerINS3. The first electrode E1 may be connected to the drain DE of thetransistor TR via a third contact hole CH3 defined through the thirdinsulating layer INS3.

A pixel definition layer PDL may be disposed on the first electrode E1and the third insulating layer INS3 to expose a predetermined portion ofthe first electrode E1. For example, as shown in the embodiment of FIG.8 , the pixel definition layer PDL may be disposed on lateral edges ofthe first electrode E1 and may expose a central portion of the firstelectrode E1. The pixel definition layer PDL may include an openingPX_OP defined therethrough to expose the predetermined portion of thefirst electrode E1.

The light emitting layer OEL may be disposed on the first electrode E1in the opening PX_OP. In an embodiment, the light emitting layer OEL maygenerate a light having a red, green, or blue color. In addition, thelight emitting layer OEL may generate a white light by combining organicmaterials respectively generating red, green, and blue colors. However,embodiments of the present inventive concepts are not limited theretoand the colors of the light emitting layer OEL may vary. The lightemitting layer OEL may include an organic light emitting material.However, embodiments of the present inventive concepts are not limitedthereto or thereby. For example, the light emitting layer may include aquantum dot or a quantum rod.

The second electrode E2 may be disposed on the pixel definition layerPDL and the light emitting layer OEL. A thin film encapsulation layerTFE may be disposed on the second electrode E2. Holes and electronsinjected into the light emitting layer OEL may be recombined to generateexcitons, and the light emitting element OLED may emit the light by theexcitons that return to a ground state from an excited state. The lightemitting element OLED may emit red, green, and blue lights depending ona flow of current, and thus, may display an image.

As shown in the embodiment of FIG. 8 , a touch sensing unit TSP may bedisposed on the thin film encapsulation layer TFE. The touch sensingunit TSP may sense an external input, such as a user's touch, etc., mayconvert the external input to a predetermined input signal, and mayapply the input signal to a display panel including the pixels PX. Thetouch sensing unit TSP may include a plurality of touch sensor portionsto sense the external input. In an embodiment, the touch sensor portionsmay sense the external input by a capacitance method.

The color filter CF and a black matrix BM may be disposed on the touchsensing unit TSP. The color filter CF may overlap the pixel area PA, andthe black matrix BM may overlap the non-pixel area NPA.

In an embodiment, the color filter CF may have one of the red, green,and blue colors. The color filter CF may convert the light incidentthereto to the light having one of the red, green, and blue colors. Inan embodiment, the color filter CF may be formed by the depositionapparatus EV. The base substrate BS shown in the embodiment of FIG. 6may be the base layer SUB shown in the embodiment of FIG. 8 . The colorfilter CF may be formed on the base layer SUB. However, embodiments ofthe present inventive concepts are not limited thereto. For example, thebase substrate BS shown in the embodiment of FIG. 6 may include the baselayer SUB, components stacked between the base layer SUB and the touchsensing unit TSP, and the touch sensing unit TSP. However, theconfiguration of the base substrate BS may vary and should not belimited thereto or thereby.

A fourth insulating layer INS4 may be disposed on the color filter CFand the black matrix BM. In an embodiment, a protective layer may bedisposed on the fourth insulating layer INS4.

The deposition apparatus EV may include the vacuum chamber CB, thedeposition source VS, the mask frame MF, and the mask MST, and thedeposition source VS, the mask frame MF, and the mask MST may bedisposed in the vacuum chamber CB. The mask frame MF may include thesupport substrate SU, the heat dissipation plate RH, and the fixingportions FP disposed between the support substrate SU and the heatdissipation plate RH. As the heat dissipation plate RH is disposed onthe support substrate SU, the absorption of the heat radiation energyEA, which is generated from the deposition source VS, by the supportsubstrate SU may be reduced. In addition, since the support substrate SUand the heat dissipation plate RH are spaced apart from each other withthe fixing portion FP interposed therebetween, the heat transferred tothe support substrate SU from the heat dissipation plate RH may bereduced. Accordingly, the deposition accuracy of the depositionapparatus EV may be increased.

FIGS. 9A and 9B are images showing results of a thermal analysis withrespect to a mask frame according to a comparative example and a maskframe according to embodiment of the present inventive concepts. FIG. 9Ashows a change in temperature due to the heat transfer in the mask frameof the comparative example that includes the support substrate and doesnot include the fixing portion and the heat dissipation plate in color.FIG. 9B shows a change in temperature due to the heat transfer in themask frame of the embodiment of the present inventive concepts thatincludes the support substrate, the fixing portion, and the heatdissipation plate in color.

In FIGS. 9A and 9B, a Y-axis indicates a relative temperature, and thetemperature increases from a lower side to an upper side. A first areaof the mask frame that is positioned at the lower side of the Y-axis andshown in a color close to blue represents a lower temperature than asecond area of the mask frame that is positioned at the upper side andshown in a color close to red.

The mask frame of FIG. 9A shows colors close to the upper side of the Yaxis. The mask frame of FIG. 9B shows colors close to the lower side ofthe Y axis. When compared with the mask frame of the comparative exampleof FIG. 9A, the mask frame of an embodiment of the present inventiveconcepts shown in FIG. 9B represents a relatively lower temperatureoverall. In addition, as shown in FIG. 9A, a color difference in a leftside of the mask frame of the comparative example is large, and thus, itmay be concluded that a temperature difference in the mask frame of thecomparative example is relatively large. However, as shown in FIG. 9B,an overall color difference is small in the mask frame of an embodimentof the present inventive concepts, and thus, it may be concluded thatthe temperature difference in the mask frame is not large.

Accordingly, in the mask frame including the heat dissipation platedisposed on the support substrate and the fixing portion disposedbetween the heat dissipation plate and the support substrate, theabsorption rate of the heat radiation energy may be lowered, and thedeformation of the mask frame due to the heat may be reduced orprevented.

The mask frame may include the support substrate including the innerside surfaces, the heat dissipation plate disposed on the inner sidesurfaces of the support substrate, and the fixing portions disposedbetween the support substrate and the heat dissipation plate. The heatdissipation plate may cover the inner side surfaces of the supportsubstrate and may reduce or prevent the deformation of the supportsubstrate, which is caused by the heat radiation energy generated in thedeposition process. As the deformation of the support substrate due tothe heat is reduced or prevented, the deposition accuracy of thedeposition process using the mask frame may be increased.

The deposition apparatus may include the vacuum chamber and the maskframe disposed in the vacuum chamber. The deposition source and the maskmay be disposed in the vacuum chamber, and the mask may be disposedabove the mask frame. The mask frame may include the support substrate,the heat dissipation plate disposed on the support substrate, and thefixing portions disposed between the support substrate and the heatdissipation plate. As the heat dissipation plate is disposed on thesupport substrate, the absorption of the heat radiation energy, which isgenerated from the deposition source, by the support substrate may bereduced. Accordingly, the deformation of the support substrate due tothe heat may be reduced or prevented, and the deposition accuracy of thedeposition apparatus including the mask frame may be increased.

Although embodiments of the present inventive concepts have beendescribed, it is understood that the present inventive concepts shouldnot be limited to these embodiments but various changes andmodifications can be made by one ordinary skilled in the art within thespirit and scope of the present inventive concepts.

Therefore, the disclosed subject matter should not be limited to anysingle embodiment described herein.

What is claimed is:
 1. A mask frame comprising: a support substrateincluding a plurality of inner side surfaces, the plurality of innerside surfaces defining a first opening through the support substrate; aheat dissipation plate disposed on the plurality of inner side surfaces;and a plurality of fixing portions disposed between the supportsubstrate and the heat dissipation plate, the plurality of fixingportions includes a plurality of adhesive portions attaching the supportsubstrate to the heat dissipation plate and a plurality of secondopenings defined there through adjacent to the plurality of adhesiveportions.
 2. The mask frame of claim 1, wherein the plurality of fixingportions are disposed directly between the support substrate and theheat dissipation plate.
 3. The mask frame of claim 1, wherein: thesupport substrate comprises: a plurality of first overlap portions thatoverlaps the plurality of fixing portions; and a plurality of firstnon-overlap portions that does not overlap the plurality of fixingportions, and the heat dissipation plate comprises: a plurality ofsecond overlap portions that overlaps the plurality of fixing portions;and a plurality of second non-overlap portions that does not overlap theplurality of fixing portions.
 4. The mask frame of claim 3, whereinfirst lateral side edge of the plurality of first overlap portions andfirst lateral side edge of the plurality of second overlap portions aresubstantially parallel to each other in a cross-section.
 5. The maskframe of claim 1, wherein the heat dissipation plate and the supportsubstrate are spaced apart from each other with the plurality of fixingportions interposed therebetween.
 6. The mask frame of claim 1, wherein:the support substrate comprises a first upper surface and a first lowersurface spaced apart from the first upper surface in a first direction,the heat dissipation plate comprises a second upper surface and a secondlower surface spaced apart from the second upper surface in the firstdirection, and a first height of the support substrate in a directionsubstantially perpendicular to the first upper surface and the firstlower surface is the same as a second height of the heat dissipationplate in the direction substantially perpendicular to the second uppersurface and the second lower surface.
 7. The mask frame of claim 1,wherein: the heat dissipation plate comprises a first surface adjacentto the support substrate and a second surface spaced apart from thefirst surface in a first direction; and the second surface ismirror-finished.
 8. The mask frame of claim 1, wherein: the heatdissipation plate comprises a plurality of sub-heat dissipation plates;and each of the plurality of sub-heat dissipation plates is disposed onthe plurality of inner side surfaces.
 9. The mask frame of claim 1,wherein the heat dissipation plate has an emissivity that is less thanor equal to about 0.25.
 10. The mask frame of claim 1, wherein the heatdissipation plate comprises at least one compound selected from Ag, Al,Cu, Cr, and Sn.
 11. The mask frame of claim 1, wherein each of theplurality of fixing portions has a thickness in a range of about 0.05 mmto about 10 mm in a direction substantially perpendicular to theplurality of inner side surfaces and a side surface of the heatdissipation plate facing the plurality of inner side surfaces.
 12. Themask frame of claim 1, wherein: the support substrate comprises an uppersurface and a lower surface spaced apart from the upper surface in afirst direction; and each of the plurality of inner side surfaces isinclined with respect to the upper surface and the lower surface. 13.The mask frame of claim 1, wherein the support substrate comprisesinvar.
 14. The mask frame of claim 1, wherein: the plurality of fixingportions includes three or more fixing portions; and the three or morefixing portions are spaced apart from each other in a cross-section. 15.The mask frame of claim 1, wherein the support substrate and theplurality of fixing portions comprise a same metal material as eachother.